BIT’s 5th Annual World Congress of Smart Materials-2019 (WCSM-2019), successfully held in Sheraton Parco de' Medici Rome Hotel on March 6-8, 2019. Totally, there were nearly 400 participants from more than 34 countries and areas have attended the WCSM-2019.
On behalf of the committee of WCSM-2019, Dr. Florin Udrea (Fellow of Royal Academy of Engineering; Head of High Voltage Microelectronics and Sensors Lab, Cambridge University of UK) had hosted the Opening Ceremony & Keynote Forum. Many world-class honored guests presented at this congress and gave their brilliant invited speeches, among them are Dr. Bantval Jayant Baliga, Distinguished University Professor, North Carolina State University, USA; Member, National Academy of Engineering, USA; Fellow, IEEE, USA; Dr. Alexander Aseev, Academician, Russian Academy of Sciences, Russia; Chief Scientist, Novosibirsk State University, Russia; Mr. Robert Whitman, Vice President Global Carrier Networks Market Development, Corning Optical Communications, USA; Dr. Kari Hjelt, Head of Innovation, Graphene Flagship, Sweden. Beside the Keynote Forum, 42 parallel speech sessions have been held successfully, which themes cover the nanomaterials, biomaterials, optical and electronic materials, composite materials, as well as the cutting-edge application of smart materials. Meanwhile, many participants are also showing their new founding by posters and exhibitions, and exchanged the new business opportunity with each other.
During the conference date, many participants expressed their satisfaction with the content of the congress and had fine memories of Rome. Depending on the warmly support and good suggestions from all of the participants, we feel quite confident to announce that our next conference WCSM-2020 will be held in Barcelona, Spain during March 11-13. We are sure you can meet many world-class scientists during our conference, but also you can enjoy the beauty of Barcelona.
Forum 1: Smart Materials Application in AI | Forum 2: Smart Materials for Information and Communications Technology |
Forum 3: Smart Electronic Materials | Forum 4: Smart Nanomaterials |
Forum 5: Smart Materials for Energy and Environment | Forum 6: Smart Biomaterials and Bio-engineering |
Forum 7: Smart Composite Materials | Forum 8: Smart Material for Mechanical Engineering and Manufacturing |
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Dr. Jayant Baliga, Member, National Academy of Engineering, USA; Fellow, IEEE, USA |
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Mr. Robert Whitman, Vice President Global Carrier Networks Market Development, Corning Optical Communications, USA
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Dr. Alexander Aseev, Academician, Russian Academy of Sciences, Russia; Chief Scientist, Novosibirsk State University, Russia |
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Dr. Kari Hjelt, Head of Innovation, Graphene Flagship, Sweden
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Dr. Florin Udrea, Professor, Cambridge University, UK |
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Dr. Anthony W. Coleman, Fellow of the Royal Society of Canada; Professor, University of Lyon, France |
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Dr. Brando Okolo, Director and CTO, Apium Additive Technologies GmbH – Karlsruhe, Germany |
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Dr. Alain Ponton, Director, Paris Diderot University and National Center of Scientific Research, France |
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Dr. Paul Lecoq, Senior Physicist, European Organization for Nuclear Research (CERN), Switzerland |
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Dr. Jordi Sune, Professor, Universitat Autònoma de Barcelona, Spain |
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Ms. Christl Lauterbach, Managing Director & Founder, Future-Shape GmbH, Germany |
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Dr. Stephen Coulson, Chie Science Officer & Chief Technical Officer, P2i Ltd, UK |
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Mr. Robert Purgert, President, Energy Industries of Ohio Inc., USA |
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Dr. Wael Zatar, Dean and Professor, College of Information Technology and Engineering, Marshall University, USA |
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Dr. Gina Oliver, Senior Director, American Chemistry Council, USA |
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Mr. Gaetano Lo Guzzo, Director, Laser Business Europe, Yamazaki Mazak, Italy |
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Dr. Shinobu Fujita, Chief Research Officer, Toshiba Corporation, Japan |
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Dr. Andreas Heilmann, Professor & Head of Department, Fraunhofer IMWS, Germany |
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Mr. Friedhelm Herzog, Senior Manager, Messer Group GmbH, Germany |
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Dr. Tatsuoki Kono, Professor, Tohoku University, Japan |
Murata Machinery, Ltd., Japan
SIA P&M-Invest Ltd., Russia
aixACCT Systems GmbH, Germany
NETZSCH-Feinmahltechnik, Germany
ViscoTec Pumpen- u. Dosiertechnik GmbH, Germany
WEARE TECH, France
Sion Power Corporation, USA
i-CORE Technology, LLC., USA
Arterius Ltd., UK
MCA Technologies GmbH, Switzerland
Cleanpart Group GmbH, Germany
Future-Shape GmbH, Germany
3DCeram, France
Kao Corporation, Japan
Trent Capital Management, USA
Add: East Area, F11, Building 1, Dalian Ascendas IT Park, 1 Hui Xian Yuan, Dalian Hi-tech Industrial Zone, LN 116025, China
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